Afera has welcomed the recent clarification published in the Official Journal of the European Union regarding the regulatory status of adhesive films used in industrial production processes under the Packaging and Packaging Waste Regulation (PPWR).
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Dassault Systèmes and the France-based pioneer of natural cosmetics have announced their collaboration to strengthen Groupe Rocher’s research and development with virtual twins — advanced science-based technologies already proven in all industries.
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Timed to coincide with MACH, which runs from 20–24 April at the NEC Birmingham, Target Integration has published a new industry report titled Navigating the Energy Crisis: A Digital Survival Guide.
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According to new UCAS data, chemical, biochemical and process engineering student numbers are on...
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Toray Composite Materials America has entered a carbon fibre supply agreement with Syensqo SA that will span five years.
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UltiMaker, leader in desktop and industrial 3D printing, is the exclusive North and South American distributor for Tectonic-3D, an advanced materials developer specialising in high-performance polymer filaments, supporting Tectonic-3D’s aggressive market penetration efforts into the defense, oil and gas, industrial repair and medical market segments.
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Semidynamics, an advanced computing company developing memory-centric AI infrastructure for large-scale inference, today announced a strategic investment from SK hynix, one of the world’s leading memory manufacturers. The investment reflects a shared conviction that memory architecture, not compute alone, will define the economics of next-generation AI inference, where cost per token is the metric that matters.
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ByteSnap Design has released guidance for industrial IoT manufacturers facing the complex task of migrating long-lifecycle connected devices away from legacy cellular networks.
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New from Emerson is the NI Channel Emulator System Software (CHESS) platform, a new software‑defined approach that enables aerospace and defence teams to validate mission‑critical radio frequency (RF) links entirely in the lab, without the cost, risk or logistics of traditional field testing.
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Under a new strategic partnership, cavity pressure sensors and process monitoring systems from Kistler Instrument Corporation are integrated directly into FimmTech’s injection moulding seminars, connecting measurement-based process control with practical, hands-on training.
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Latest
Sandvik Coromant announces the completion of CoroDrill DE10 assortment with the introduction of two new geometries, -M5F and -M5C. These additions expand the drill’s optimization potential and strengthen its position as a versatile, plug‑and‑play solution for short‑hole drilling across all materials.
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Tria Technologies has launched the new COM-HPC Client Computer-on-Modules (CoM) product, powered by the Intel Core Ultra Processors (Series 3).
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Mark Richards, UK sales manager at Beckhoff Automation UK, explains how intralogistics operations can scale in phases, rather than rebuilding everything from scratch.
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The Lee Company has opened a 27,500 square foot Innovation Centre. This has been built to accelerate product development and reinforce the company’s continued commitment to innovation in miniature.
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IMI’s Industrial Automation’s new technical engineering centre at its Lichfield site...
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BMF Clear from Boston Micro Fabrication (BMF) is an optically transparent photopolymer resin engineered for applications requiring exceptional light transmission and micron-level accuracy, such as microfluidics, photonics, advanced optical components, biomedical devices and more.
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The ultra-compact DTCD and DTCJ DIP switches with a 1.27 mm pitch enable significant PCB space savings while maintaining high functional density. With a low profile of just 2.2 mm, SMT optimization and reliable electrical performance, they are ideal for compact, cost-efficient designs in industrial, communication and medical applications.
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The new Vertiv™ CoolPhase Wall, is a space-saving, wall-mount cooling system designed for small IT spaces and edge environments. This is designed to remove heat and enable continuous operation while taking up zero floor space.
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Greene Tweed, a global leader in high-performance materials and engineered components, has named...
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According to Siemens, in collaboration with NVIDIA, its Veloce proFPGA CS hardware-assisted verification and validation system is empowering designers and system architects to create even more optimised designs by running and capturing trillions of verification cycles, prior to first silicon availability.
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