Power Integrations has extended the power range of flyback converters to 440 W – well beyond the limits that traditionally required more complex resonant and LLC topologies.
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Connectors for eVTOL applications must meet a unique set of stringent requirements beyond those...
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New from Yokogawa Test & Measurement Corporation are the 720252 1 MS/s 16-bit isolation module, featuring wide-range DC offset-adjust capability, and the 720301 power measurement module, delivering guaranteed DC/AC waveform accuracy.
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To help businesses reduce energy consumption, lower operating costs and accelerate their transition to high-efficiency operations, Technidrive has launched an electric motor scrappage scheme.
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Zel Components, the alternative electronic parts supplier, has launched a new platform that combines cost-optimised components, quality assurance and supplier transparency, while also allowing engineers to sample selected products without committing to production volumes.
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Rapid Fusion, the large format additive manufacturing (LFAM) specialist, is targeting a €1m global...
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Microelectronics US 2026 will bring together engineers, system architects and technology leaders from across semiconductors, photonics and embedded systems to tackle the real-world challenges shaping how next-generation products are designed, built and deployed.
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Coherix, a global leader in AI-based quality-control systems for adhesive and sealant dispensing, will host a two-day open house program at its new Innovation Center in Ann Arbor, Michigan. Attendees will be able to explore the next generation of intelligent manufacturing and precision dispensing technology.
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Infosys and Formula E have launched a new AI-powered Race Centre. Powered by Infosys Topaz, the Race Centre places fans at the centre of the action, using intelligent data to create an immersive race-day experience powered by cutting-edge innovations in AI and digital technology.
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Curtiss-Wright has integrated the Cooperative Electronic Support Measure Operations (CESMO)...
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Latest
PCBs must survive impact, flexing and thermal cycles while carrying hundreds of components. Here, Stephanie Williams, senior product specialist at materials testing expert Instron, explores how mechanical testing reveals the hidden vulnerabilities of these assemblies and how engineers can simulate these forces, ensuring PCBs can withstand real-world stresses.
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A major upgrade to Hexagon’s BendingStudio XT software and TubeInspect system enables...
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ChemUK, the UK’s largest annual B2B event dedicated to the entire chemicals sector, from chemicals...
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ifm has launched the LMH point level sensor, a robust solution engineered for reliable medium...
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The Vickers by Danfoss Variable Speed Drive (VSD) solution – available in Europe, the Middle...
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Premium fastener manufacturer BUMAX has expanded its global footprint to countries throughout Eastern Europe with Budapest-based Tibor Prezenszki at the helm.
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According to the latest labour market analysis by Randstad, the AI boom is actively redefining...
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Analog Devices’ new manufacturing facility in Thailand will further strengthening its...
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AI is no longer an innovation story, writes Brian O’Hare, Service Director at BCS Consultancy. It is an operational stress test for the entire data centre ecosystem, and commissioning has become the point where theoretical design meets operational reality. That stress is most visible in the infrastructure layer that has changed most rapidly: cooling.
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According to Perforce Software’s State of Automotive Software Development Report, AI is...
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