Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fibre‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
Teramount will continue to operate as a design and engineering hub in Jerusalem, supported by Molex’s global optical capabilities. It will become part of the Optical Connectivity segment within the Optical Solutions Business at Molex.
“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor‑grade wafer‑level processes—filling a critical gap in the optical stack,” said Aldo Lopez, president, Datacom Solutions, Molex. “By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”
For more information, visit www.molex.com.
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