At electronica this November, Texas Instruments (TI) will be in Hall C4, booth 159, showcasing how decades of design, system and manufacturing expertise are enabling the company to continue innovating what’s next across embedded development, industrial automation, automotive electronics and power infrastructure for AI.

During the event, TI will demonstrate how its analog and embedded processing semiconductors, software and tool ecosystem enable innovation across key application areas:

  • Accelerating embedded development: As embedded systems grow more complex, TI is enabling agentic AI within its CCStudio development tool ecosystem and adding Zephyr RTOS support across its MCU, MPU and wireless portfolios to help engineers write and migrate code, configure systems, debug and deploy systems faster.
  • Transforming industrial automation: The shift toward physical AI in production environments requires increased reliability and deterministic control. TI provides these capabilities through a portfolio of real-time MCUs, GaN-based motor drivers and multimodal sensing, alongside supporting multi-protocol industrial communication standards for next-generation automation.
  • Architecting intelligent vehicles: Addressing the transition to AI-defined, zonal vehicle architectures, TI processors enable real-time sensor fusion and autonomous decision-making. Complementing this, TI’s scalable 12V and 48V architectures provide distributed power from driver assistance systems to chassis control.
  • Powering AI from grid to gate: Today’s AI workloads are driving an increasing need for efficient power, networking and thermal management. TI is addressing this demand by enabling next-generation energy infrastructure with solid-state transformers, GaN-based AC/DC converters and battery management with integrated EIS. Additionally, TI’s complete 800VDC power solutions enable efficient and reliable AI data centers.

TI speakers at electronica 2026:

  • Monday, Nov. 10
  • 10:00-10:20 a.m. CET: Heinz-Peter Beckemeyer presents “Future-proofing the Automotive Supply Chain Under the EU Cyber Resilience Act” at the Cybersecurity Forum.
  • 10:35-11:15 a.m. CET: Artem Aginskiy participates in “Panel: Building the Embedded Platforms for Tomorrow’s Mobility: From Silicon to Software-Defined Vehicles” at the Embedded Systems Forum.
  • 4:30-5:30 p.m. CET: Vinay Agarwal participates in “Roundtable: AI at the Edge for IIoT” at the IIoT Forum.
  • Wednesday, Nov. 12
  • 2:20-2:40 p.m. CET: Marian Kost presents “Accelerating Embedded: How Open Source and AI Agents are Changing the Playing Field” at the Embedded Developer Forum.
  • Thursday, Nov. 13
  • 12:50-1:15 p.m. CET: Henrik Mannesson presents “Beyond the Iron Core: How Semiconductor Innovation Is Unlocking Next-Gen Grid Infrastructure” at the Power Electronics Forum.

Learn more: https://www.ti.com/

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