The Tactilus heat-sink analysis system from Sensor Products enables research and design engineers to quickly and precisely test and correct the surface contact and pressure distribution between the heat sink and semiconductor.
Engineers are able to visualise actual contact forces and pressure distribution data on the circuit board components. As the mounting screws between the CPU and the heat sink are torqued, the system maps and measures the changing pressure distribution between the mating surfaces and displays it through its software. The heat sink interface can be tested, manipulated and repositioned in real-time, speeding the trial and error process and eliminating the need for additional assembly.
The pressure data needed for FEA simulation predictions is also provided.
